| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC module of which the reliability is improved by reducing a rate of bonding wire disconnection defect occurrence within an IC card, and the IC card.SOLUTION: The IC module comprises: a module substrate 2 that is a support body; an IC chip 5; an external terminal 1 for connecting the IC chip with an external circuit; and a sealing resin 7 for partially sealing the IC chip and the module substrate. The IC chip is adhered on one surface of the module substrate, and a plurality of external terminals are provided on the other surface. Rear faces of external terminals exposed in module substrate openings 2a that are formed by removing a part of the module substrate on bottom faces of the external terminals, and an electrode of the IC chip are electrically connected. While surrounding a region in which the module substrate openings are formed, a groove is formed with a such a depth that the groove does not penetrate the surface of the module substrate on which the IC chip is formed. The groove is filled with the sealing resin.SELECTED DRAWING: Figure 1 |
