| 摘要 |
PURPOSE:To manufacture a lead frame in which a pitch of leads is reduced by holding an interval of inner leads of a minimum limit to the width of a surface of the end of the lead to be wire bonded irrespective of an unavoidable instability for etching. CONSTITUTION:A metal plate is etched to form inner leads 1 having a width smaller than a predetermined width necessary for wire bonding on a surface 1a to be wire bonded, the leads 1 formed in the etching step are pressed, and the width of the surface 1a to be wire bonded of the lead 1 is formed to be equal to the predetermined with or more. |
