| 摘要 |
OPTICAL INSPECTION SYSTEM FOR SOLDER JOINTS AND INSPECTION METHOD The adequacy of the fillets (24, 26) by which the lead (22) is soldered to pad (28) on printed circuit board (16) is evaluated by providing low angle diffuse illumination from circular fluorescent lamp (34) and observing the image with a television camera. The electronic image information is digitized and analyzed to produce a signal corresponding to the adequacy of the fillets and thus the adequacy of the solder joint. Automatic inspection is achieved and the signal can be employed to translate the printed wiring board to a new position for automatic inspection of another solder joint. |
