发明名称 |
Method and apparatus for forming a ball at a bonding wire end |
摘要 |
In a method and apparatus for making uniform size balls at the end of bonding wires, a constant current circuit is installed between a high voltage power source and a discharge electrode so that a constant high voltage is applied between the bonding wire end and the discharge electrode and a discharge voltage is detected by a discharge voltage detecting circuit so that the thus detected discharge voltage is converted into a time so that a discharge time setting circuit which controls the constant current circuit regulates the discharge time period of the high voltage.
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申请公布号 |
US5214259(A) |
申请公布日期 |
1993.05.25 |
申请号 |
US19920887068 |
申请日期 |
1992.05.22 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
TERAKADO, YOSHIMITSU;SASAKURA, KAZUMASA |
分类号 |
H01L21/60;B23K20/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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