发明名称 Method and apparatus for forming a ball at a bonding wire end
摘要 In a method and apparatus for making uniform size balls at the end of bonding wires, a constant current circuit is installed between a high voltage power source and a discharge electrode so that a constant high voltage is applied between the bonding wire end and the discharge electrode and a discharge voltage is detected by a discharge voltage detecting circuit so that the thus detected discharge voltage is converted into a time so that a discharge time setting circuit which controls the constant current circuit regulates the discharge time period of the high voltage.
申请公布号 US5214259(A) 申请公布日期 1993.05.25
申请号 US19920887068 申请日期 1992.05.22
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 TERAKADO, YOSHIMITSU;SASAKURA, KAZUMASA
分类号 H01L21/60;B23K20/00 主分类号 H01L21/60
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