| 摘要 |
PURPOSE:To obtain a thick film hybrid integrated circuit which insures highly efficient radiation of heat of a semiconductor element and improves bonding accuracy and frequency characteristic of the semiconductor element and conductor film. CONSTITUTION:A recessed area 1a is formed on an insulating substrate 1 and moreover a conductor film 3 for output is extended toward the bottom surface of the recessed area 1a from the surface of the insulating substrate 1, a heat radiating plate 6 mounting a semiconductor element 5 at the upper surface thereof is brazed to the output conductor film 3a formed at the bottom surface of the recessed area and the semiconductor element 5 and conductor films 2, 3 for input and ground on the insulating substrate 1 are bonded with wires 7a, 7b. |
