| 摘要 |
PURPOSE:To reduce noise due to crosstalk between leads by a method wherein the leads, which are sued as signal conductors, are held by leads, which are at earth potential, in a lead frame. CONSTITUTION:Earth leads 6 are arranged in such a way as to hold signal leads 3, through which a signal and a power supply are led out to the outside, between them. An IC chip 7 is mounted on an island 2 and the leads 3 are connected with pads 8 on the periphery of the chip through metal wires 9. At this time, pads 8a, which are used as earth potentials, on the chip are connected with a metallic plate 5 through metal wires and moreover, the plate 5 is connected with leads 3a, which are at earth potential, through metal wires. Thereby, the plate 5 and the leads 6 are at earth potential and it becomes possible to reduce noise due to crosstalk between the leads 3. |
