发明名称 |
LAMINATE OF COPPER AND RESIN AND ITS MANUFACTURE |
摘要 |
PURPOSE:To provide a laminate of copper and resin whose adhesion between copper and resin is improved without damaging acid resistance properties of copper and a manufacturing method thereof. CONSTITUTION:A laminate is formed by laminating copper whose surface is provided with mainly hexagonal patterned cracks on resin integrally. The laminate is formed by forming mainly hexagonal patterned cracks on a surface of copper and by laminating the copper and resin integrally. |
申请公布号 |
JPH05121871(A) |
申请公布日期 |
1993.05.18 |
申请号 |
JP19910280180 |
申请日期 |
1991.10.28 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
TANNO TOMIO |
分类号 |
B32B15/08;H05K1/09;H05K3/38;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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