发明名称 LAMINATE OF COPPER AND RESIN AND ITS MANUFACTURE
摘要 PURPOSE:To provide a laminate of copper and resin whose adhesion between copper and resin is improved without damaging acid resistance properties of copper and a manufacturing method thereof. CONSTITUTION:A laminate is formed by laminating copper whose surface is provided with mainly hexagonal patterned cracks on resin integrally. The laminate is formed by forming mainly hexagonal patterned cracks on a surface of copper and by laminating the copper and resin integrally.
申请公布号 JPH05121871(A) 申请公布日期 1993.05.18
申请号 JP19910280180 申请日期 1991.10.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TANNO TOMIO
分类号 B32B15/08;H05K1/09;H05K3/38;H05K3/46 主分类号 B32B15/08
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