| 摘要 |
A wave soldering apparatus with a wave height control device. The apparatus includes a solder pan (28), a tray (32) arranged in the pan and provided with at least one wave-forming nozzle, a driving assembly (52) for supplying the solder from the pan to the tray and creating a wave, and an assembly for moving a printed circuit board over the nozzle. The apparatus further includes a well (70) having an open top portion (72) and communicating with said nozzle (36) via a duct (76) so that said solder fills up the duct and enters the well, and an assembly (80) for sensing the level (78) of solder in the well. |
