摘要 |
A photosensitive composition of this invention comprises: (a) a photosensitive diazo resin represented by the following general formula (I): <IMAGE> (I) wherein R1, R2 and R3 each represents a hydrogen atom, an alkyl or alkoxy group, R represents a hydrogen atom, an alkyl or phenyl group, X represents PF6 or BF4 and n represents a number of 1 to 200, in which a resin with the number n in the above formula being 5 or more is contained by more than 20 mol %, (b) an oleophilic high molecular weight compound with hydroxyl group and (c) a high molecular weight organic acid without hydroxyl group, and in which the content of the ingredient (c) is from 1.5 to 30% by weight based on the solid matter in said composition. The photosensitive composition of this invention can provide a photosensitive layer having high sensitivity and being excellent in storage stability and developability as well as excellent in the film strength. |
申请人 |
KONICA CORP.;MITSUBISHI KASEI CORP., TOKIO/TOKYO, JP |
发明人 |
TOMIYASU, HIROSHI, TAMA-KU KAWASAKI-SHI KANAGAWA-KEN, JP;MAEDA, YOSHIHIRO, YOKOHAMA-SHI KANAGAWA-KEN, JP;GOTO, KIYOSHI;SUZUKI, NORIHITO, HACHIOJI-SHI TOKYO, JP |