Method of soldering including removal of flux residue.

摘要

Soldering is performed and the residues associated with the soldering process are removed through the use of a specific process. Components such as two integrated circuits or an integrated circuit and mounting board are initially tacked by compression bonding or through the use of adhesives. Flux is introduced, and the components to be soldered are brought to reflow temperature. The flux is chosen so that upon reflow and subsequent cooling to a temperature of 100 DEG C, or lower, the flux remains in liquid state. The flux is then easily removed by cleaning with a miscible liquid that is subsequently removed through processes such as spinning and evaporation.