| 摘要 |
<p>PURPOSE:To provide a low viscosity copper ink composite for metallizing a ceramic. CONSTITUTION:A low viscosity copper ink composite for metallizing a ceramic, which consists of a metallic component mainly of copper, a binder, and an organic component, and having 20 to 100 cP of viscosity is composed. By using this composite with a brush, for example, the copper metallizing can be applied freely to a curving part of a ceramic. Since a copper film can be formed on a curving form of ceramic by such a simple means, it can be applied to a complicated form of electronic part.</p> |
