| 摘要 |
<p>PURPOSE:To prevent displacement of a semiconductor chip at the time of resin molding by connecting two semiconductor chips with rear faces closely adhering to each other to an outer lead by tape leads, attaching a first fixing member to a surface of one of the semiconductor chips and attaching a second fixing member to a surface of the other semiconductor chip. CONSTITUTION:Semiconductor chips 3A, 3B are connected to an outer lead 6a by tape leads 5A, 5B. A first fixing member 20A is fixed to a surface of the semiconductor chip 3A by adhesive 21 as well as a second fixing member 22A is fixed to a surface of the semiconductor chip 3B by the adhesive 21. Therefore, when this assembly is set in a metal mold and is subjected to resin molding, even if force is applied to the semiconductor chips 3A, 3B due to injection pressure of mold resin 7, the first fixing member 20A regulates a distance from an upper metal mold while the second fixing member 22A regulates a distance from a lower metal mold. Thus, a tape lead can be prevented from appearing on a package surface, thereby preventing electric snort-circuiting with outside at the time of packaging.</p> |
