| 摘要 |
PURPOSE:To obtain an inverting type IC in which high density packaging is possible with simple wiring and reliability is excellent by folding an outer lead of each lead toward a rear face of a semiconductor chip. CONSTITUTION:A first plurality of electrode pads 22a and a second plurality of leads 34b of a semiconductor chip 21 are connected with one another by wires 33, a second plurality of electrode pads 22b and a first plurality of leads 34a of the semiconductor chip 21 are connected with one another by the wires 33, and the semiconductor chip 21, the first and second pluralities of leads 34a, 34b and the wires 33 are resin-sealed by a package body 27 so that an outer lead 35 of each lead is exposed while the outer lead of each lead is folded toward a rear face 21b of the semiconductor chip 21. |
