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发明名称
HEAT-DISSIPATING STRUCTURE FOR ELECTRONIC CIRCUIT UNIT
摘要
申请公布号
JPH05110276(A)
申请公布日期
1993.04.30
申请号
JP19910270900
申请日期
1991.10.18
申请人
FUJITSU LTD
发明人
SASAKI KOJI
分类号
H05K7/20;H01L23/40
主分类号
H05K7/20
代理机构
代理人
主权项
地址
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