| 摘要 |
PURPOSE:To cut down the cost of a semiconductor device, to improve the stability in positional accuracy when a wire is connected to an electrode pad, and to accomplish the improvement in stability of loop shape by a method wherein a plurality of through holes are provided in parallel with each other on a capillary, a plurality of wires are passed through the through holes, and the plurality of wires are bonded simultaneously. CONSTITUTION:A wire 3 is passed through a plurality of paralleled through holes 2 on a capillary 1 respectively, and the tip of the wire 3 is sphered by electric discharge. The capillary is moved, pressure is applied to an electric pad 5 and a relaying point 6, they are junctioned by ultrasonic vibration, and the wire 3 is cut off. As a result, a plurality of wires can be bonded simultaneously. Also, as the pitch of capillary through holes is fixed, the stability of positional accuracy can be improved when the wire is connected to the electrode pad, and at the same time, the irregularity of loop shape generating due to the nonuniformity of capillary locus control by the repetition reproducibility accuracy of a wire bonding device can be reduced. |
