| 摘要 |
PURPOSE:To enable an assembly failure caused by the positional deviation of a bonding metal wire to be electrically and instantaneously detected by a method wherein a check operation to find that a short circuit occurs between inner leads 18 and 19 and a grounding inner lead 17 or not is carried out at the same time when the characteristics of a semiconductor device is executed. CONSTITUTION:A pattern 15 is provided optionally surrounding bonding pads 13 and 14 provided onto a semiconductor chip 11 and distant from them as prescribed, the pattern 15 is connected to a grounding pad 12 through its peripheral part, the bonding pads 12, 13, and 14 are connected to inner leads 17, 18, and 19 through bonding metal wires 20, 21, and 22, and the assembly concerned is sealed up with sealing resin 23. |
