| 摘要 |
PURPOSE:To prevent generation of solder bridging between adjoining outer leads even though the pitch becomes small. CONSTITUTION:A group of terminal lands 20, 30 are mounted on the surfaces of a printed circuit board 11 alternately so that two adjoining ones are located on opposite sides, and a plurality of through holes 23, 33 are provided at the front side lands 21 and rear side lands 30. Outer leads 25, 35 are provided at the tips with insertion parts 26, 36, which are inserted in the through holes 23, 33. Because of this alternate arrangement of lands 20, 30, the pitche P of each group of lands becomes wider twice as large as in the conventional arrangement where all lands are located on the front side. Corresponding to the amount of this pitch widening, generation of solder bridging between adjoining lands can be prevented. |
