| 摘要 |
<p>PURPOSE:To prevent the deformation of a lead and the drop of soldering property at the time of electric property test of a semiconductor device and at the time of carriage to a storage container, and lower the heat resistance by molding the semiconductor side and the rear side of a lead frame into the shape of having a groove, where one part of a lead is exposed, with resin. CONSTITUTION:An IC chip 5 is loaded on a die pad 4, and those are connected to an outer lead 2 by a bonding wire 3. Moreover, the IC chip loading side and the rear side of the IC chip 5, the die pad 4, and the outer lead 2 are molded with resin into the shape having a groove 14 where one part of the lead is exposed. Thereupon, the heat of the IC chip 5 diffuses to outside air through resin 1 or the outer lead 2, and the heat resistance drops. Hereby, the heat resistance of a semiconductor device can be dropped, and the outer lead does not contact with a tray at storage of the semiconductor device, and also at the test of electric property, the outer terminal of a prober does not contact with the outer lead, and the deformation or the separation of solder can be prevented.</p> |
