| 摘要 |
PURPOSE:To provide a semiconductor wafer heater without being corroded unlike a metallic heater, low in heat loss, with the temp. increased at a high rate, capable of competing with even an ultrahigh vacuum condition and with the ceramic heater capable of being freely attached, detached or exchanged. CONSTITUTION:A resistance heating element 9 is embedded in a discoid dense ceramic substrate 8, for example. A lumpy terminal 7 is electrically connected to the end of the element 9, and the terminal 7 is exposed to the rear 30b. A cylindrical body 2 consisting of an inorg. insulating material such as alumina is fixed to the wall surface of a flange 1 through a support 21. Airtightness is maintained between the body 2 and flange 1 by a brazing filler metal 23, and both members are made inseparable. A slender power supply member 3 is allowed to pierce the inner space of the body 2 and a through-hole 1c. The power supply member 3 and the lumpy terminal 7 are electrically connected through an elastic body 4 consisting essentially of tungsten. |
