HEAT TRANSFER PLATE AND INTEGRATED CIRCUIT CHIP OR OTHER ELECTRIC COMPONENT ASSEMBLY INCLUDING PLATE SUCH AS DESCRIBED ABOVE

摘要

PURPOSE: To realize a heat plate for removing heat efficiently from an IC pack age and an assembly employing the heat transmission plate. CONSTITUTION: The heat transmission plate 100 fixed to a recess in a containing socket means 62 in order to remove heat from the fixing side of an electric component is made of a thermal conductive material to have external shape being received in a recess. It has inner shape for receiving the component on the fixing side having direct heat transmission relationship with one surface. The plate 100 extends from a containing socket in order to diffuse heat transmitted from the fixing side of the component and provided, at a predetermined position, with means for disposing the electric component.