发明名称 LEAD FRAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE, AND MANUFACTURE THEREOF
摘要 PURPOSE:To eliminate the need for removing a driver after a transfer-molding by enclosing a space between leads with a bridging member when a molding die is applied to a lead frame. CONSTITUTION:There is provided a bridging section 14 which is fixedly bonded between leads 8 located at a boarder 13 equivalent to the outer surface of sealing resin 9 and extends between the leads 8 and which is as thick as the leads 8. The bridging section 14 couples the leads respectively and maintains their positions. When a molding die is applied to a lead frame for transfer molding and the leads 8 are clamped with the die, the following roles are fulfilled: More specifically, a space 7 between the leads 8 is enclosed with the bridging component 14 and the sealing resin injected from a molding cavity of the molding die is arranged to pass through the space 7, thereby preventing leakage out. It is, therefore, possible to eliminate the need for removing a diver after a transfer-molding.
申请公布号 JPH0595079(A) 申请公布日期 1993.04.16
申请号 JP19910255516 申请日期 1991.10.02
申请人 IBIDEN CO LTD 发明人 KONDO MITSUHIRO;WATANABE OSAMU
分类号 H01L23/28;H01L23/433;H01L23/495;H01L23/498;H01L23/50 主分类号 H01L23/28
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