发明名称 CURABLE RESIN COMPOSITION
摘要 <p>PURPOSE:To provide the title composition excellent in heat resistance, thermosettability and pattern design, to be used for e.g. the protective films for resists, comprising a polyglycidyl methacrylate and a thermosetting agent containing specific azo-and/or distyrylpyridine-based compound (s). CONSTITUTION:The objective composition comprising (A) a thermosetting agent containing (1) an azo-based compound of formula I [R1-R5 are each H, halogen, (substituted) alkyl, alkoxy, hydroxyl, nitro or COOR7 (R7 is H, alkyl, etc.); R6 is group of formula II (R8 is alkyl), (substituted) naphthyl or of formula III (R9 and R10 are each H, alkyl, aryl, etc.)] and/or (2) a distyrylpyridine-based compound of formula IV [R11 and R12 are each H, (substituted) alkyl, aryl or COR13 (R13 is alkyl, aryl, etc.)] and (B) a polyglycidyl methacrylate (e.g. glycidyl methacrylate-methacrylic alkyl ester copolymer).</p>
申请公布号 JPH0593044(A) 申请公布日期 1993.04.16
申请号 JP19920007432 申请日期 1992.01.20
申请人 SUMITOMO CHEM CO LTD 发明人 TAKEYAMA NAOMIKI;YAMAMOTO SHIGEKI
分类号 C08G59/20;C08G59/00;C08G59/32;C08G59/40;C08K5/16;C08L63/00;G02B5/20;G03F7/027;G03F7/038;H01L21/027;H01L23/29;H01L23/31 主分类号 C08G59/20
代理机构 代理人
主权项
地址