| 摘要 |
<p>PURPOSE:To provide a composite substrate for heat dissipation with a good heat dissipation. CONSTITUTION:A composite substrate for heat dissipation comprises a glass ceramic multilayer substrate 1 made of the first to sixth layers and an aluminum nitride substrate 2. The composite substrate has a structure in which viaholes 4 for heat dissipation on the second to sixth layers are perforated more than viaholes 3 for heat dissipation on the first layer. Since the structure is very simple, an easy manufacture and the substrate with a good heat dissipation can be obtained. Further. the more sophisticated substrate for an integrated circuit capable of performing a high density mounting and a high-speed signal processing, etc., can be provided.</p> |
