METHOD OF TREATING WAFER,申请号JP19910274919-传众专利搜索

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发明名称	METHOD OF TREATING WAFER
摘要
申请公布号	JPH0590250(A)	申请公布日期	1993.04.09
申请号	JP19910274919	申请日期	1991.09.27
申请人	KOKUSAI ELECTRIC CO LTD	发明人	NAKAMURA NAOTO;MIYA HIRONOBU;ENDO YOSHIHIDE
分类号	H01L21/316	主分类号	H01L21/316
代理机构		代理人
主权项
地址

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