| 摘要 |
PURPOSE:To easily realize a high-reliability TAB package which enables easy application to many models of semiconductor chips and decreases in bonder facilities, bump materials, and bump forming cost. CONSTITUTION:Bumps are transferred onto film leads by thermocompression bonding to leads 7 one by one, and simultaneously semiconductor chip electrodes and film leads with bumps 5 are bonded by ultrasonic oscillation, heating, and pressurization to the leads one by one. A bonding tool 8 used at this time is structured by separation and isolation into a heating zone, an ultrasonic oscillation zone, and a pressurization zone. This design can easily provide a lowtemperature, low-stress, and high-reliability junction and dispenses with counter layout of bumps on a board to chip electrodes, so that bump layout can be lattice-shaped. Therefore, model exchange of semiconductor chips can easily be executed in a short time. |
