SEMICONDUCTOR INTEGRATED CIRCUIT AND MANUFACTURE OF MOUNTING APPARATUS THEREOF

摘要

PURPOSE: To provide a semiconductor integrated circuit and its method for reducing a crack in a lead-on-chip packaging device and chip-on-lead packaging device. CONSTITUTION: A semiconductor chip 21 is adhered to a lead-on-chip type lead frame 23 having a lead finger 25 by its active surface. The semiconductor chip 21 has a polyimide covering 29 on the reverse side. A capsule-sealing material 26 surrounds the semiconductor chip 21 and the lead-on-chip type lead frame 23 so that the lead fingers 25 are exposed. The polyimide covering 29 on the reverse side of the semiconductor chip 21 reduces a packaging crack that is generated due to the mounting of this device on a printed circuit board by reflow soldering.