发明名称 |
MULTI-LAYER STRUCTURE AND METHOD OF FABRICATION THEREOF |
摘要 |
A multi-layer structure that includes a transparent dielectric substrate, a layer of a nickel-containing steel alloy, and a layer of copper and/or chromium. The structure is used as multi-density photomasks for example. The process for fabricating multi-layer structure, like a multi-density photomask comprises: a) providing a transparent dielectric substrate having a steel layer and a layer of a metal, like of copper, thereon with the layer of said steel is deposited on top of said layer of a metal or vice versa; b) providing a layer of photoresist material on top of the structure provided in step (a); c) exposing and developing said layer of photoresist material; d) selectively etching exposed portion of said metal or said steel; e) selectively etching exposed portion of said metal or said steel not etched in step (d); f) exposing and developing photoresist on the said layer of said metal or said steel etched in step (d); g) selectively etching exposed portion of said metal or said steel of step (f); and h) removing the photoresist. t |
申请公布号 |
EP0273392(B1) |
申请公布日期 |
1993.04.07 |
申请号 |
EP19870119137 |
申请日期 |
1987.12.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FLAGELLO, DONIS GEORGE;SHAW, JANE MARGARET;WITMAN, DAVID FRANK |
分类号 |
G03F1/00;G03F1/54;H01L21/027 |
主分类号 |
G03F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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