| 摘要 |
PURPOSE:To enable a semiconductor device of ultra-thin type package to be released from a molding die without causing any damage to its resin outer casing. CONSTITUTION:A sub-heater 7 which is used for local heating is buried in a molding die adjacent to the surface of a cavity independent of a heater 5 which is used for continuous heating, and the sub-heater 7 is turned ON or OFF synchronously with closing or opening the molding dies to keep the surface of cavity uniform in temperature by heating. By this setup, the setting of the resin outer casing 3 in contact with the surface of cavity and the exudation of a releasing agent are rendered uniform. |
