MULTI-CHIP MODULE AND MANUFACTURE THEREOF

摘要

PURPOSE:To obtain low cost and high density multi-chip modules. CONSTITUTION:A chip component 24 is connected to a film carrier by means of solder reflow where a middle part of a lead 23 of the film carrier is connected to an outer electrode of a first circuit board 11, thereby connecting a film carrier-based circuit board to the first circuit board 11 and forming one circuit module. At the same time, the tip of the lead of the film carrier serves as an outer lead of the module. It is, therefore, possible to connect LSI chips and chip components in parallel and reduce manhour since it is not necessary to connect the outer lead alone so that low cost and high density multi-chip modules can be obtained. It is also possible to form multi-terminal outer leads at fine pitches and higher density since the leads of the film carrier are used for the outer leads.