发明名称 |
METODO PARA FORMAR UN CONTACTO ELECTRICAMENTE CONDUCTOR |
摘要 |
A method of forming an electrically conductive contact on an insulated substrate such as for example a printed circuit board includes the step of defining a contact area on the substrate and applying a copper buss on the substrate so that it extends beyond the marginal edges of the contact area. A thin layer of soldermask is then applied to cover the upper surface of the copper buss outside of the contact area. Thereafter, a Thick Film Polymer (TFP) conductive paste is applied over the copper buss in the contact area defined on the substrate and over a small portion of the soldermask so that the copper buss is covered completely. <IMAGE> |
申请公布号 |
MX9206131(A) |
申请公布日期 |
1993.04.01 |
申请号 |
MX19920006131 |
申请日期 |
1992.10.23 |
申请人 |
CIRCO CRAFT CO. INC. |
发明人 |
ALAIN LANGEVIN;BENOIT AUGER;CHARLES CASAVANT;WOLFGANG ERAT |
分类号 |
H05K1/09;H05K3/24;H05K3/34;(IPC1-7):H01R4/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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