| 摘要 |
<p>PURPOSE:To reduce the number of drive ICs and the number of wire bonding by a method wherein a plurality of LED elements in arranged LED array chips are divided into a plurality of groups, and a drive signal is selectively applied to the LED elements per group. CONSTITUTION:A number of LED array chips (C1-C110) each having a number of LEDs (L1-L128) are aligned in a line adjacently to each other. On one side of the alignment, drive ICs (ICs1-IC110) are juxtaposed by the same number as the LED array chips. On the anode side of the LEDs, adjacent two LEDs are respectively connected to the drive ICs. On the other hand, on the cathode side, the LEDs are commonly connected to two transistors (TrA, TrB). At this time, the LEDs on the odd-numbered positions are connected to the collector side of the transistor TrA, and the LEDs on the even-numbered positions are connected to the collector side of the transistor TrA. The transistors TrA, TrB, are grounded on the emitter side.</p> |
