发明名称 Sputtering apparatus for producing thin films of material
摘要 A sputtering apparatus for coating a substrate comprising a first electrode for supporting a target material and a second electrode for supporting a substrate, upon which the coating is deposited. A source of RF power is connected to impose an RF voltage across the electrodes to produce a glow discharge in the space between the electrodes, and shutter means is provided in the space between the electrodes. The shutter means has means for blocking a substantial part of the sputtered atoms from the target electrode glow discharge traveling at or near normal incidence and at least one opening shaped to permit a substantial part of the sputtered atoms from the target electrode traveling at an oblique angle to impinge upon the substrate to produce a thin film coating of the target material.
申请公布号 US5198090(A) 申请公布日期 1993.03.30
申请号 US19910807766 申请日期 1991.12.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GALICKI, ARKADI;HORNG, CHENG T.;SCHWENKER, ROBERT O.
分类号 C23C14/22;C23C14/34;H01J37/32 主分类号 C23C14/22
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