发明名称 |
Sputtering apparatus for producing thin films of material |
摘要 |
A sputtering apparatus for coating a substrate comprising a first electrode for supporting a target material and a second electrode for supporting a substrate, upon which the coating is deposited. A source of RF power is connected to impose an RF voltage across the electrodes to produce a glow discharge in the space between the electrodes, and shutter means is provided in the space between the electrodes. The shutter means has means for blocking a substantial part of the sputtered atoms from the target electrode glow discharge traveling at or near normal incidence and at least one opening shaped to permit a substantial part of the sputtered atoms from the target electrode traveling at an oblique angle to impinge upon the substrate to produce a thin film coating of the target material.
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申请公布号 |
US5198090(A) |
申请公布日期 |
1993.03.30 |
申请号 |
US19910807766 |
申请日期 |
1991.12.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GALICKI, ARKADI;HORNG, CHENG T.;SCHWENKER, ROBERT O. |
分类号 |
C23C14/22;C23C14/34;H01J37/32 |
主分类号 |
C23C14/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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