Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith

摘要

In a light transmissive epoxy resin composition comprising (A) an epoxy resin and (B) a curing agent are blended (C) an organic phosphorus anti-discoloring agent and (D) silica-titania glass beads surface treated with an organic silicon compound. The composition restrains coloring in composition form and discoloration in cured form while curing into clear low stressed products having high light transmittance. Optical semiconductor devices encapsulated with the cured epoxy resin composition are reliable.