RESIN COMPOSITIONS FOR SEALING SEMICONDUCTORS

摘要

A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) a graft polymer of an epoxy resin having the structure (I); and a vinyl polymer and (ii) a soft vinyl-modified silicone polymer as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.