| 摘要 |
PURPOSE:To enable wiring to be highly dense and multilayered by connecting an outermost layer conduction layer and an inner-layer conduction layer or inner-layer conduction layers without providing a penetration hole in a multilayer printed-wiring board. CONSTITUTION:After coating a light-sensitive insulation resin 9 on a laminated board 10 where a via hole 4 and a circuit pattern are formed, a photo via hole is formed by a photo-printing method. After that, plating and etching are performed, thus enabling a multilayer board to be formed. Then, a multilayer board which is formed by a similar method and the above multilayer board are thermocompressed through a prepreg and a conductive paste, thus obtaining a multilayer printed-wiring board which does not required any penetration hole. |
