IC PACKAGE,申请号JP19910261278-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	IC PACKAGE
摘要
申请公布号	JPH0574972(A)	申请公布日期	1993.03.26
申请号	JP19910261278	申请日期	1991.09.13
申请人	NIPPON AVIONICS CO LTD	发明人	MOROHASHI AKIRA
分类号	H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

您可能感兴趣的专利

维塑水龙带修补机

三相交流电焊机

Regulating circuit for the impedance regulation of an arc furnace.

Derivatives of 10,11,12,13-tetra-hydrodesmycosin, processes for preparation, and use thereof in obtaining pharmaceuticals.

Ferroelectric ceramic transducer.

Method of mounting semiconductor elements.

Porous titania spheres.

全浮动单盘磨

酚基桐油树脂的合成方法

复合塑料编织袋四角热熔合工艺及装置

新型胶合板

经改进的离子源

配制钢锭模涂料用固体粉料

Process and apparatus for shaping and clamping thin workpieces of large dimensions in a predetermined calculated profile.

Process for manufacturing gypsum building materials.

Astaxanthin intermediates.

Material handling vehicle steering system.

Apparatus for dubbing a recorded video type in synchronism with the playing of the video tape.