发明名称 |
Integrated circuit package with molded cell |
摘要 |
An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.
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申请公布号 |
US5196374(A) |
申请公布日期 |
1993.03.23 |
申请号 |
US19910801254 |
申请日期 |
1991.12.03 |
申请人 |
SGS-THOMSON MICROELECTRONICS, INC. |
发明人 |
HUNDT, MICHAEL J.;KELAPPAN, KRISHNAN |
分类号 |
G11C5/14;H01L23/495 |
主分类号 |
G11C5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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