| 摘要 |
PURPOSE:To perform the accurate grinding in a processing for grinding a mirror surface of a wafer to be ground by fitting a wafer to be ground to a grinding top ring without adhesion, and always pushing the whole surface of the wafer to be ground to the abrasive cloth of the turntable with the uniform pushing force. CONSTITUTION:A wafer chuck 3 having a suction mechanism is provided in a top ring 1 to suck for holding a wafer to be ground. A pressurizing plate 2, to which the wafer chuck 3 is fitted, it hung by a pressurizing plate holding part 16 of the top ring 1 through an elastic body sheet 5, and the pressure fluid is supplied to a sealed space 8 inside of the top ring 2 surrounded by the elastic body sheet 5 to always maintain the pushing force, which is applied to the whole surface of the wafer to be ground, constant. The pressurizing plate 2 and a fixing tool 4 of the wafer chuck 3 are made of the material having elasticity at a degree, which can be deformed elastically in comparison with the pressurizing plate holding part 16, to absorb the unevenness of thickness of the sucked wafer to be ground. |
