| 摘要 |
<p>A film-type power resistor (10), comprises a flat nonmetal chip (13) having a high dielectric strength, and having relatively high thermal conductivity for a nonmetal, a resistive film (18) applied to the upper surface of the chip (13), terminals (21, 22) connected mechanically to the upper surface of the chip (13) and connected electrically to the resistive film (18), and a molded electrically insulating body (11) embedding those portions of the terminals (21, 22) that are relatively adjacent the chip (13), and also embedding the upper portion of the chip (13). The lower chip surface (14) and the body (11) being so related to each other that the lower surface (14) is exposed and may be engaged in flatwise relationship to a flat region of a chassis. The chip (13) serves as a substrate for the film (18), as a heatsink for heat generated by the film (18), as an insulator maintaining the film (18) electrically insulated from the chassis, and as a spacer maintaining the terminals (21, 22) spaced from the chassis. <IMAGE></p> |
