| 发明名称 |
LEAD-BASED SOLDER ALLOY AND ITS USE IN SOFT SOLDERING |
| 摘要 |
Wave soldering of electronic component in particular if carried out in a substantially oxygen-free inert atmosphere utilising a quaternary solder alloy consisting of 1 to 15 wt% tin, 1 to 13 wt% antimony, 1 to 15 wt% bismuth with the balance being lead. |
| 申请公布号 |
AU2401092(A) |
申请公布日期 |
1993.03.16 |
| 申请号 |
AU19920024010 |
申请日期 |
1992.08.06 |
| 申请人 |
MULTISCORE SOLDERS LIMITED |
发明人 |
GORDON ARBIB;HECTOR ANDREW HAMILTON STEEN |
| 分类号 |
B23K35/26;H05K3/34 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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