POLYIMIDE FILM HAVING IMPROVED ADHESIVE PROPERTIES

摘要

Disclosed herein is a polyimide film produced by forming a film from a raw material having incorporated therein a finely divided inorganic powder that forms minute projections on the film surface and subsequently subjecting the film to corona discharge treatment. According to this invention, it is possible to obtain a heat-resistant polyimide film having improved adhesive properties and uniform bond strength. The film does not cause blocking when wound into a roll. Polyimide film finds general use as electrical insulation film, heat insulation film and base film for flexible printed circuit boards.