| 摘要 |
<p>PURPOSE:To mount a larger-sized chip on a circuit board, to make the circuit board superior in temperature cycle resistance and to improve the reliability of the board by a method wherein the circuit board having a small difference between the thermal expansion coefficients of the Si chip and the board is used. CONSTITUTION:A film conductor 2 containing a noble metal as its conductive component is formed on the surface of a cordierite ceramic substrate 1 and a film resistor 3 is formed between electrodes 4 for resistor use on the film conductor. The film conductor and the film resistor are covered with a protective film 6 leaving a connection terminal part 5 of a component which is mounted on the substrate. A glass component constituting the film resistor consists of 70 to 80wt.% of SiO2, 30 to 20wt.% of B2O3 and 0.1 to 5.0wt.% of Al2O3 in terms of metallic oxide. The film resistor consists of this glass component and a ruthenium oxide, there is not the generation of a crack in the film resistor, which is formed by being heat-treated at a temperature of 950 deg.C or lower on the substrate made of ceramic of a thermal expansion coefficient of 2X10<-6> to 5X10<-6>/ deg.C including cordierite, and a change in the resistance value of the film resistor is small.</p> |
