| 摘要 |
<p>PURPOSE:To provide a die bonder apparatus which economically realizes positioning of an LSI and a package with good reproducibility in the die bonding process. CONSTITUTION:A die absorbing collet 1 is positioned and is then set within a package with a positioning jig 2 to maintain displacement between the centers of LSI 3 held by the die absorbing collet 1 and a cavity 5-1 of the package 5 within an extremely small range.</p> |
