| 摘要 |
PURPOSE:To prevent an irregularity in an exposure exceeding an allowable value due to a correction based on a parameter such as a rotation, an inclination, an offset, etc., of a semiconductor chip unit. CONSTITUTION:A method for manufacturing a semiconductor device exposes by using a reticle of a semiconductor chip 11 formed on a semiconductor substrate 1. The method comprises the steps of dividing active region 11a of the chip 11 into a plurality of divided regions 21, 22, 23 and 24 by alignment marks 11c, lid provided in an inactive region 11b and an active region 11a of the chip 11 and detecting the positional deviation of the substrate 1 at the respective regions 21, 22, 23 and 24; and unitarily adding a correction obtained by integrating the positional deviations of the regions 21, 22, 23 and 24 at the chip 11 unit to the entire chip 11, aligning it and then exposing it. |
