| 摘要 |
<p>A wire bonding apparatus for semiconductor devices has a drive for driving a supporting block (7) for holding the workpiece, the drive being capable of vertically moving and stopping the supporting block (7) at a predetermined position, an optical means (10,11) disposed above the supporting block (7) and used for recognizing the pattern of the workpiece held on the supporting block (7), a storage means (30) for prestoring each level of the workpiece and a control unit (29) for controlling the drive, moving the workpiece to the position stored in the storage means (30) and stopping the workpiece at that position. The supporting block (7) is supported by a stroke bearing (8) comprising a fixed part (8a) and a moving part (8b) which is moved and guided in the direction perpendicular to the fixed part (8a). The drive for driving the supporting block comprises a drive cam (21) secured onto a cam shaft (26) and generating a uniform velocity cam curve, a cam follower (20) for coming contact with the drive cam (21), and a cam-driving pulse motor (27) capable of rotating the cam shaft (26) and electrically controlling the angle of rotation of the drive cam (21).</p> |
