DIPPING TYPE SURFACE TREATMENT APPARATUS

摘要

A dipping type wafer treatment apparatus includes housing having first and second openings, a wafer treatment bath provided inside the housing, a clean air unit for producing a downflow, a flow rectifier for introducing the downflow into the housing, a communicating chamber provided below the housing being partitioned from a space inside the housing, a duct for guiding mist in the vicinity of the treatment bath in the housing into the communicating chamber together with the downflow, and a pump for forcing air out of the communicating chamber from an air outlet provided in the communicating chamber.