| 摘要 |
<p>PURPOSE:To improve reliability by eliminating an island itself which causes a resin crack without necessity of island lowering process which causes a residual stress, so as to place a semiconductor element in a lead frame. CONSTITUTION:A lead frame is separated into a signal layer 1 and a ground layer 2 to be formed in a laminated structure. The layer 1 does not have an island, a lead for hanging the island, and the layer 2 does not have them as well. Openings 9, 10 are provided at island positions of the layers 1, 2. The opening 9 to be provided on the layer 1 is larger than the size of a semiconductor element 4, and the opening 10 to be provided on the layer 2 is smaller. The element 4 is so disposed as to be dropped in the opening 9 of the layer 1, and placed on the opening 10 of the layer 2 of a lower stage of the layer 1. The element 4 is connected to a peripheral edge of the opening 10 of the layer 2 with paste 5. The entirety is molded by sealing resin 7.</p> |
