| 摘要 |
<p>A bonding wedge (1) for an ultrasonic bonder, in particular an aluminium thick wire bonder, with a wire guide in the form of a through-passage (3) extending in the wire direction obliquely from above to the pressing face (2). A plastics sleeve (11) through which the bonding wire (4) is guided is introduced in the through-passage (3) to reduce significantly the frictional resistance of the bonding wire (4) in the region of the through-passage (3) and to reduce significantly the abrasion of aluminium.</p> |
