| 摘要 |
A bonding head assembly including a retaining block having a vacuum suction hole or electromagnet on its concave surface formed on the undersurface, a central shaft loosely passing through the central hole of the retaining block and having a bonding tool at the lower end, an oscillating ball attached to the upper part of the central shaft. After the bonding tool is brought into in contact with a workpiece, vacuum suction or electromagnet is activated so that the oscillating ball is brought into a tight contact with the concave surface of the retaining block, thus securely retaining the oscillating ball in the retaining block and, as a result, setting the position of the central shaft and therefore the bonding tool.
|
