| 摘要 |
PURPOSE:To allow the execution of alignment with high accuracy by constitut ing the method for alignment to be applied to a proximity exposing device in such a manner that this method can easily dealt with various gap spacings and the simultaneous observation of a wafer and mask is possible and the influence of the shape of wafer marks is hardly received. CONSTITUTION:A mask 19 provided with a Fresnel zone plate 18 is disposed in front of a sample 17 and the Fresnel zone plat 18 is irradiated perpendicularly with coherent light 20 to obtain the images of the luminescent point or bright line 21 generated on the surface of the sample 17 by imaging with a microscope objective lens 28. In addition, the surface of the sample 17 is irradiated with incoherent light 22 and the sample 17 or the mask 19 is so moved that the image on the surface of the sample 17 is likewise obtd. by imaging with the microscope objective lens 28 and that the luminescent point or bright line 21 exists in the prescribed position with respect to the mark 23 for alignment of the sample 17. |
